1、采用手動(dòng)翻蓋/雙扣式結(jié)構(gòu),操作方便；上蓋的IC壓板采用旋壓式結(jié)構(gòu),下壓平穩(wěn),保證IC的壓力均勻,不移位
2、探針的特殊頭形突起能刺破焊接球的氧化層，接觸可靠，而不會(huì)損傷錫球
3、高精度的定位槽和導(dǎo)向孔，保證IC定位精確，測(cè)試效率高；測(cè)試頻率可達(dá)9.3GHz
4、用途：集成電路應(yīng)用功能驗(yàn)證測(cè)試；可根據(jù)用戶要求定做各種陣列的socket
5、有翻蓋式結(jié)構(gòu)和雙扣結(jié)構(gòu)兩種方式可供選擇,操作方便；上蓋的IC壓板采用旋壓式結(jié)
| Pith e(mm) | Pin Cout | Package Size(mm) | Part Number | Clamshell/Open top |
| 0.5 | 30 | 11.5*13 | eMMC自動(dòng)機(jī)臺(tái)測(cè)試治具 | Open top |
| 0.5 | 221 | 11.5*13 | eMCP221芯片測(cè)試治具 | Clamshell |
| 0.5 | 153/169 | 11.5*13 | eMMC153/169通用socket+轉(zhuǎn)接板—新結(jié)構(gòu) | Clamshell |
| 0.5 | 162/186 | 12*12 | eMCP162/186通用socket+轉(zhuǎn)接板—新結(jié)構(gòu) | Clamshell |
| 0.5 | 162/186 | 11.5*13 | eMCP通用socket+功能分析轉(zhuǎn)接板 | Clamshell |
| 0.5 | 153/169 | 11.5*13 | eMMC153/169通用socket+轉(zhuǎn)接板 | Clamshell |
| 0.5 | 153/169 | 11.5*13 | eMMC通用socket+功能分析轉(zhuǎn)接板 | Clamshell |
| 0.5 | 162/186 | 11.5*13 | eMCP162/186通用socket+轉(zhuǎn)接板 | Clamshell |
| 0.5 | 30 | 11.5*13 | eMMC153/169探針轉(zhuǎn)SD芯片測(cè)試座 | Clamshell |
| 0.5 | 30 | 12*16 | eMCP162/186探針轉(zhuǎn)SD芯片測(cè)試座 | Clamshell |
| 0.5 | 30 | 11.5*13 | eMMC153/169測(cè)試座轉(zhuǎn)USB接口 | Open top |
| 0.5 | 35 | 11.5*13 | eMCP162/186測(cè)試座轉(zhuǎn)USB接口 | Open top |
| 0.5 | 30 | 11.5*13 | eMMC153/169翻蓋彈片轉(zhuǎn)SD接口測(cè)試座 | Clamshell |
| 0.5 | 35 | 14*18 | eMCP162/186翻蓋彈片轉(zhuǎn)SD接口測(cè)試座 | Clamshell |
| 0.5 | 30 | 12*18 | eMMC153/169下壓彈片轉(zhuǎn)SD接口測(cè)試座 | Open top |
| 0.5 | Customized | 12*16 | eMCP186/62下壓彈片轉(zhuǎn)SD接口測(cè)試座 | /Open top |
| 0.5 | Customized | 12*16 | 三星黃點(diǎn)轉(zhuǎn)DIP48探針測(cè)試座 | Clamshell |
| 0.5 | Customized | 13.5*9.5 | 鎂光黃點(diǎn)轉(zhuǎn)DIP48探針測(cè)試座 | Clamshell |
| 0.5 | Customized | 14*18 | Samdisk黃點(diǎn)轉(zhuǎn)DIP48探針測(cè)試座 | Clamshell |
掃一掃
